Specification Summary
| Batch configuration options: |
50 x 150/200mm Si / AlTiC 25 x 150/200mm Si / AlTiC |
| Wafer orientation: |
In plane of the magnetic field direction Option for in process wafer positioning -180 degrees to +180 degrees |
| Magnetic field range: | Up to 5.0 Tesla variable |
| Magnet type: | Closed loop superconducting magnet |
| Magnetic homogeneity: | +/- 3 % |
| Magnetic uniformity: | +/- 1 degree |
| Magnetic set-point accuracy: | < 5 m Tesla |
| Stray field: | < 0.5 m Tesla at 1 m from tool |
| Magnet thermal stability: | Cryostat temperature <5 K for up to 8 hours after power outage |
| Thermal range: |
150 – 400 C Option to extend to 600 C |
| Ramp rate: | Up to 8 C/min |
| Set-point accuracy: | 1 C |
| Thermal uniformity: | +/- 2 C |
| Vacuum range: | 2 torr to <5E-7 torr |
| Gas: | Up to 4 process gasses |
| Contamination monitoring and control: |
Automated ROR check Options for; Gas line filters and Oxygen scrubbers RGA fitted to process chamber |
| Wafer loading: |
Automated via EFEM |
| Load-port capacity: | 2 x 25 wafer manual load cassette |
| Wafer alignment: |
<0.1 degrees by automated pre-aligner |
| Connectivity: | SECS/GEM capable |
| Installation configuration: | Bay/Chase or ballroom to class 10 |
| Performance metrics: |
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| Installation |
Worldwide by Magnetic Solutions Ltd |
| Warranty | 1 year warranty |
