Specification Summary
| Batch configuration options: |
10 x 200/300mm Si 25 x 200/300mm Si 50 x 200/300mm Si 100 x 200/300mm Si |
| Wafer orientation: |
In plane or transverse to the magnetic field direction Option for in process wafer positioning -180 degrees to +180 degrees |
| Magnetic field range: |
Up to 5.0 Tesla variable - MRT5000/300 Up to 2.0 Tesla variable - MRT2000/300 |
| Magnet type: | Closed loop superconducting magnet |
| Magnetic homogeneity: | +/- 3 % |
| Magnetic uniformity: | +/- 1 degree |
| Magnetic set-point accuracy: | < 5 m Tesla |
| Stray field: | < 0.5 m Tesla at 1 m from tool |
| Magnetic shield: | Passive or Active shielding |
| Magnet thermal stability: | Cryostat temperature <5 K for up to 8 hours after power outage |
| Thermal range: | 150 – 600 C |
| Ramp rate: | Up to 8 C/min |
| Set-point accuracy: | 1 C |
| Thermal uniformity: | +/- 2 C |
| Vacuum range: | 2 torr to <5E-7 torr |
| Gas: | Up to 4 process gasses |
| Tool pressure monitor: | Per I300I Options for; Airborne particle monitor Gas line filters and Oxygen scrubbers RGA fitted to process chamber |
| Wafer loading: |
Automated via EFEM |
| Load-port capacity: | 2 x 25 wafer FOUP |
| Wafer alignment: | <0.1 degrees by automated prealigner |
| Option for: |
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| Certifications: | SEMI S2 /S8, CE, Seismic zone 4 |
| Connectivity: | SECS/GEM capable, SEMI 0306, Interface A |
| Installation configuration: | Bay/Chase to ISO Class 2 |
| Performance metrics: |
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| Installation: | Worldwide by Magnetic Solutions Ltd |
| Warranty: | 1 year warranty |
| Patents | US 7,479,621 Patents pending |
