Specification Summary
| Batch configuration options: |
50 x 150/200mm Si / AlTiC (2 process modules) 25 x 150/200mm Si (/ AlTiC 1 process module) |
| Wafer orientation: |
In plane or transverse to the magnetic field direction Option for in process wafer positioning -180 degrees to +180 degrees |
| Magnetic field range: |
0.2 Tesla - MRT200 0.4 Tesla - MRT400 |
| Magnet type: | Permanent magnet |
| Magnetic homogeneity: | +/- 3 % |
| Magnetic uniformity: | +/- 1 degree |
| Magnetic set-point accuracy: | < 5 m Tesla |
| Stray field: | < 0.5 m Tesla at 1 m from tool |
| Magnetic shield: | Passive shielding |
| Thermal range: | 150 – 450 C . Extendable to 600 C if required |
| Ramp rate: | Up to 8 C/min |
| Set-point accuracy: | 1 oC |
| Thermal uniformity: | +/- 2 C |
| Vacuum range: | 2 torr to <5E-3 torr |
| Gas: | Up to 4 process gasses |
| Contamination monitoring and control: | Automated ROR check Options for; Gas line filters and Oxygen scrubbers |
| Wafer loading: |
Automated via EFEM. Option for manual loading |
| Load-port capacity: | 2 x 25 wafer manual load cassette |
| Wafer alignment: | <0.1 degrees by automated prealigner |
| Option for: |
Wafer bar code reader OCR reader |
| Certifications: | SEMI S2 /S8, CE, Seismic zone 4 |
| Connectivity: | SECS/GEM capable |
| Installation configuration: | Bay/Chase or ballroom to class 10 |
| Performance metrics: |
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| Installation: | Worldwide by Magnetic Solutions Ltd |
| Warranty: | 1 year warranty |
