 | Superconducting magnet system |
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 | Low running costs |
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| Variable fields |
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| Increased process flexibility |
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| Closed loop cryogen system |
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| Eliminates introduction of liquid helium to clean room environment |
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| Two cold heads |
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| Faster cool down time and reduced down time |
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| Field Homogeneity less than 6% across wafer stack |
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| Increased yield |
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| Field Uniformity less than 2 degress across wafer stack |
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| Increased yield |
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| Maximum temperature 500 °C |
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| Increased process flexibility |
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| Ramp-Up/Ramp-Down rates of 6 °C/min |
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| Highest wafer throughput in the industry |
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| High Temperature Uniformity during ramps & at soak |
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| Tight tolerances lead to excellent batch consistency and improved product quality. |
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| Wafer sizes from 4 to 12 inches |
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| Flexible production planning |
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| Up to 25 wafers per batch |
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| Industry leading wafer throughput |
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| Automatic wafer rotation |
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| Flexibility in process parameters |
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| Low particle generation |
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| Increased yields |
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| Automatic wafer loading |
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| No manual handling eliminating errors and contamination |
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| Graphical user interface |
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| Reduced operator errors |
